e SIM CARD 8P H1.75
Card Slot Name: e‑SIM Card 8P, Flip‑Cover Type H1.75, Without Post Dimension: 6.76L * 7.1W * 1.75H Mounting Type: Surface‑Mount (SMT) Process Temperature Resistance: Reflow Soldering (260℃) Operating Temperature: -40℃ ~ +85℃ Terminal Material: Phosphor Bronze (C5191, Gold‑Plated) Product Lifespan: 5000 Cycles Packing: 2000PCS/REEL Salt Spray Test: 24H Application: 5*6*0.67 e‑SIM card and M2M card installation

Name: Chane
Tel: 13670072223
QQ: 253171635
Mail: chane@kinlica.com
Add: 4th Floor Building 1, No. 5, Tangxia Keyuan Road, Tangxia Town, Dongguan City, Guangdong Province